1-component co-polyamides are casting compounds used as thermoplastic synthetics for low pressure castings in electronic and electrical applications. These hot melt materials are not reactive. The application takes place in a permanent form comparable to plastic injection moulding. The co-polyamides have very low viscosity and therefore require low injection pressure in the die mould, and subsequent processing can be carried out with a dosing unit for low pressure casting. These hot melt materials are used whenever very short cycle times are required. We offer:
Low-pressure encapsulation technique is the ideal procedure for:
High quality thermoplastic PA hot melt adhesives with elastomer characteristics are employed as materials.
The fields of application: